Mask Tek's patented Solid Solder Deposit's and ecosphere's are available for lead-free designs. While eutectic 63/37 solder is most commonly used for conventional surface mount applications, lead free solders have gained momentum and high lead content alloys are used for some advanced applications, i.e. wafer bumping and the formation of solder spheres on ceramic components.

Contingent on PCB design, multiple alloys may also be recommended where it is desirable to have two-tiered deposits reflowing at different temperatures. Multi-tiered deposits can be particularly advantageous in loading edge connectors through multiple soldering operations.

Some of the alloys used in our processes are Sn96.5Ag3.5 (221C), Sn95Ag5 (221-245C) and SnAg3.8Cu.7 (217-221C). For assistance in meeting your application requirements, please don't hesitate to contact us.