In the early 1990's, Mask Technology explored existing methods of forming solid solder deposits (SSDs) on the bare board to enhance first pass yields at assembly. Those methods contained what were perceived as fatal defects, primarily the requirement to use dry film solder masks, or sacrificial films, in the manufacturing process as well as requiring extensive modifications of the board design.
Precision Pad Technology (PPT) was developed specifically to overcome the impediments of these technologies. PPT provides:
Bare Board:
- Macro-planar solid solder deposits (SSDs) on all SMT lands or pads;
- Controlled thicknesses of between .0007" - .030" as specified by the end user;
- Uniformity of +/- .0002";
- Customer specified alloy;
- Densities to 8 mil pitch;
- Increased Shelf Life;
- Compatible with all commercially available solder masks;
- Excellent results with SMT, BGA, DCA and Chip Scale Packages;
At Assembly:
- Eliminates solder balls, slumping and shorts;
- 20-30% improved peel strength of solder joints;
- Compensates for lead coplanarity of +/- 7 mils.
- Produces a defined solder "gap";
- Improves line efficiency;
- Eliminates rework; and
- Enhances thermal performance of assemblies in the field.
Precision Pad Technology (PPT) is an enabling technology, patented on 3 continents, that dramatically increases first pass yields at assembly. For further information on system sales or service, or to receive additional information, call us at (714) 557-3383.
More Information
- Solid Solder Deposts: An Alternative Surface Finish
- PPT Applications
- uBGA's Solder & Oven Profiles - Critical Process Variables
- Siemens Lead Free Evaluation
Data Sheets