The predominant surface finish for printed circuit boards has traditionally been Hot Air Solder Leveling (HASL) which consists of immersing circuit boards in a eutectic tin-lead alloy followed by excess solder being removed by airknives. Mask Tek has offered this process since 1989 using both vertical and horizontal systems.

Printed Circuit Boards (PCBs) have copper finishes on their surface. If left unprotected the copper will oxidize and deteriorate. While there are a number of different surface finishes available, including Organic Solder Preservatives (OSPs), Electroless-Nickel Immersion Gold (ENIG), and Immersion Silver, HASL has continued to maintain a strong sector due to its' performance at assembly.

HASL provides the lowest cost PCBs and this surface finish remains solderable through multiple reflow processes. The planarity of the surface is the most desirable at assembly, particularly with horizontal application which provides very uniform results. While lead is being eliminated in electronics due to environmental concerns, HASL is still employed in the manufacture of high reliability devices and produces excellent results.

Our HASL technicians have over 24 years of experience in the field and would be happy to answer any of your questions.